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Failure Analysis Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

Failure Analysis Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. アイテス Shiga//Electronic Components and Semiconductors
  2. ユーロフィンFQL Kanagawa//Service Industry
  3. 三映電子工業 Nagano//others
  4. 4 null/null
  5. 5 null/null
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Failure Analysis Product ranking

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. Specification verification and failure analysis through reliability testing. アイテス
  2. Failure analysis of power devices アイテス
  3. Failure analysis of electronic devices and components ユーロフィンFQL
  4. Reliability evaluation and failure analysis of joints through power cycle testing. アイテス
  5. 4 [Analysis] New Semiconductor Packaging Technology (Ag Wire Power Devices)

Failure Analysis Product List

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Specification verification and failure analysis through reliability testing.

Specification verification and failure analysis through reliability testing.

Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

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  • Other Testing Contract
  • Contract Analysis
  • Failure Analysis

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Reliability evaluation and failure analysis of joints through power cycle testing.

Reliability evaluation and failure analysis of joints through power cycle testing.

We conduct contract testing using Siemens testing equipment! We can also handle the production of various necessary jigs.

We would like to introduce our "Reliability Evaluation and Failure Analysis of Joints through Power Cycle Testing." We can evaluate the joint reliability of various components of power semiconductors and confirm what kind of abnormalities are occurring in defective parts. We can also handle the production of various jigs necessary for testing. Please feel free to contact us when needed. 【Overview of PWT2400A Equipment (Partial)】 ■ Equipped with 4 heating power supplies of 600A each ■ Equipped with 16 gate power supplies ranging from -10V to 20V ■ Capable of testing up to 16 channels of devices simultaneously ■ Compatible with water-cooled modules *For more details, please download the PDF or feel free to contact us.

  • Contract Analysis
  • Contract Analysis
  • Failure Analysis

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Fault Diagnosis AI "HOZEN"

Fault Diagnosis AI "HOZEN"

Use past incidents to make decisions on preventing recurrence. Investigate past measures and recurrences, verify the evidence, and consider the next steps.

"HOZEN" is a product that allows for the investigation of past cases, examination of causes, and comparison of countermeasures using existing defect reports, countermeasure records, and equipment documentation. In particular, it is characterized by the ability to trace the records and evidence used for decision-making. It clarifies which records and assumptions were utilized, allowing the next person in charge or the reviewer to verify them. It is aimed at personnel in the maintenance, quality assurance, and DX departments who are considering the introduction or development of "failure analysis AI" or "trouble analysis agents" in the manufacturing industry, as well as those who already have a sense of urgency regarding conducting failure analysis with AI and are contemplating whether to build from scratch internally or to quickly validate using existing systems. 【Features】 ■ Collect past histories ■ Compare before and after countermeasures ■ Separate hypotheses and verification points ■ Compare conditions of countermeasures ■ Review and report analysis ■ Apply to other equipment *For more details, please download the PDF or feel free to contact us.

  • Other information systems
  • Failure Analysis

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for analysis - Backside polishing - We accommodate various sample forms. Si chip size: 200um to 15mm square ■ Defective area identification - Backside IR-OBIRCH analysis and backside emission analysis - IR-OBIRCH analysis: Supports up to 100mA/10V and 100uA/25V Emission analysis: Supports up to 2kV * We address a wide range of defect characteristics such as low-resistance shorts, micro leaks, and high voltage breakdown failures. ■ Pinpoint cross-sectional observation of leak areas - SEM/TEM - We select SEM or TEM observation based on the predicted defects and can conduct physical observation and elemental analysis of leak defect areas with precision.

  • Contract Analysis
  • Transistor
  • Analytical Equipment and Devices
  • Failure Analysis

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LED failure analysis

LED failure analysis

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Discrimination," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "Electrical Normal" and "Open, High Resistance." 【Initial Diagnostic Items for LED Packages】 ■ Electrical Characteristics Measurement ■ Visual Inspection ■ Lens Polishing / Internal Optical Observation of the Package ■ Lighting Test (Brightness Distribution Observation) *For more details, please refer to the PDF document or feel free to contact us.

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  • Contract Analysis
  • Analysis Services
  • Failure Analysis

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Failure analysis of electronic devices and components

Failure analysis of electronic devices and components

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

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  • 400x300_ロックイン赤外線発熱解析装置_1.jpg
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  • Other contract services
  • Contract Analysis
  • Capacitor
  • Failure Analysis

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Connector and cable evaluation/failure analysis service

Connector and cable evaluation/failure analysis service

In addition to failure analysis, evaluation tests focusing not only on environmental resistance (temperature, humidity, gas, saltwater) but also on mechanical performance, physical performance, and electrical performance were conducted.

It is an electrical component and a mechanical component. Connectors that combine both functions require evaluation tests focusing not only on environmental resistance (temperature, humidity, gas, saltwater) but also on mechanical performance, physical performance, and electrical performance. Eurofins FQL offers product quality evaluations and long-term reliability assessments according to standards. Failure analysis services are also available.

  • Automotive Connectors
  • Harness
  • Waterproof Connector
  • Failure Analysis

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We will investigate the cause using various methods! HDD/SSD failure analysis service.

We will investigate the cause using various methods! HDD/SSD failure analysis service.

As a manufacturer specializing in HDD/SSD analysis, we conduct various investigations! Please feel free to consult with us first.

We offer "HDD/SSD Failure Analysis Services" and are committed to not only confirming failure events but also thoroughly investigating the true causes. We can conduct various failure analyses, including HDD disassembly investigations, analysis of contaminant gases that have infiltrated the device, and verification of the validity of manufacturer failure analysis results. Please feel free to contact us if you have any requests. 【Analysis Contents】 ■ HDD disassembly investigation and analysis of contaminant gases that have infiltrated the device ■ Analysis of contaminant components in SSDs (investigation of terminal corrosion and contact failure causes) ■ Investigation of corrosive gas generation from packaging materials (cushioning materials, sponges, cardboard) ■ Verification of the validity of manufacturer failure analysis results ■ Outgassing component investigation and usability assessment of materials procured from overseas *For more details, please download the PDF or feel free to contact us.

  • others
  • Failure Analysis

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SSD Failure Analysis Service

SSD Failure Analysis Service

We provide disability investigations that will satisfy you, backed by our extensive experience and achievements!

Our "SSD Failure Analysis Service" investigates the cause of failures through the diagnosis of failure events and the examination of controller/NAND chip malfunctions. We are committed to thoroughly uncovering the true causes of failures, not just confirming the failure events, but also understanding what types of failures are occurring and what reasons may be considered. Additionally, we can provide consulting aimed at failure improvement based on our extensive experience and knowledge. 【Service Details】 ■ Primary Diagnosis (Situation Investigation) ■ Secondary Diagnosis (Controller, NAND Chip Investigation) ■ Tertiary Diagnosis (Surface and Cross-Section Investigation of Controller and NAND Chip) *For more details, please download the PDF or feel free to contact us.

  • others
  • Failure Analysis

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HDD/SSD failure analysis service! A manufacturer specializing in HDD/SSD analysis.

HDD/SSD failure analysis service! A manufacturer specializing in HDD/SSD analysis.

Diagnosis of the situation regarding the failure event and investigation of the controller/NAND chip malfunction to identify the cause of the failure! Analysis of SSD contamination components (terminal corrosion, poor contact).

We offer "HDD/SSD Failure Analysis Services" and are committed to not only confirming failure events but also thoroughly investigating the true causes. We can conduct various failure analyses, including HDD disassembly investigations, analysis of contamination gases that have infiltrated the device, and verification of the validity of manufacturers' failure analysis results. Please feel free to contact us if you have any requests. 【Analysis Contents】 ■ HDD disassembly investigation and analysis of contamination gases that have infiltrated the device ■ Analysis of contamination components in SSDs (investigation of terminal corrosion and contact failure causes) ■ Investigation of corrosive gas emissions from packaging materials (cushioning materials, sponges, cardboard) ■ Verification of the validity of manufacturers' failure analysis results ■ Investigation of outgassing components from materials sourced overseas and determination of usability *For more details, please download the PDF or feel free to contact us.

  • others
  • Failure Analysis

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